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Webinar: COM-HPC – Next Generation High Performance Computing

February 12, 2021

Monday, 15 March 2021 from 09:00 to 12:00.

The following topics will be discussed:

  • Why a new standard? The PICMG workgroup
  • The COM-HPC connector
  • Module types and sizes
  • COM Express vs. COM-HPC
  • Cooling concepts
  • Signal integrity challenges
  • congatec COM-HPC roadmap and schedules
  • New COM-HPC interface technology
  • congatec evaluation boards
  • Q&A

To register, please send a short e-mail with your contact details to: Mr. Thomas Schrefel (thomas.schrefel@distec.de). The last day to register is 01 March 2021.

We look forward to your participation.

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