NDiS V1100



Fanless Embedded Box PC Powered by 11th Gen Intel® Core™ Tiger Lake Processor

Features:

  • 11th Gen Intel® Core™ (Tiger Lake UP3) processor SoC
  • Dual non-ECC DDR4 3200 SO-DIMM, support up to 32Gb
  • 4 x HDMI 2.0, support 4K@60Hz
  • Dual LAN ports and 3 x USB 3.0 ports
  • Onboard M.2 2280 Key M with PCIe x4 signal for storage modules
  • Onboard mini-PCIe for optional Wi-Fi or LTE modules
  • Fanless design

Ordering Information:

NDiS V1100-i3 | P/N: 10W00110000X0
NDiS V1100-i5 | P/N: 10W00110001X0

Key Features

NDiS
NDiS
NDiS
NDiS

Technical Data


Manufacturer
Nexcom
Technology
Product Series
Product Category
Box PCs
Size Diagonal
CPU Type
Intel® Core™ i
CPU
i7-1185G7E
i5-1145G7E
i3-1115G4E
Resolution (max)
Brightness [cd/m2]
Viewing angle U/D/L/R
Controller
Temperature Range Top
0...+45°C
Temperature Range Tst
-20...+80°C
Interface
HDMI
RS232
LAN Gigabit
USB2.0
USB3.0
Line-out
RS232/422/485
miniPCIe
SATA
TPM 2.0
GbE LAN
MIC in
SATA Power
GPIO header
HDD LED
Power Supply
Inputs
Outputs
Format
Dimensions
Touch
Touch Points
Glass Strength
Memory
Max. 64GB DDR4 SO-DIMM

Downloads


Below are the downloads available for this product. If you require any further information please contact us.