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February 12, 2021
Monday, 15 March 2021 from 09:00 to 12:00.
The following topics will be discussed:
- Why a new standard? The PICMG workgroup
- The COM-HPC connector
- Module types and sizes
- COM Express vs. COM-HPC
- Cooling concepts
- Signal integrity challenges
- congatec COM-HPC roadmap and schedules
- New COM-HPC interface technology
- congatec evaluation boards
- Q&A
To register, please send a short e-mail with your contact details to: Mr. Thomas Schrefel (thomas.schrefel@distec.de). The last day to register is 01 March 2021.
We look forward to your participation.
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